Mobile Phone Cooling Plate Heat Sink Expend Cooling Area

Mobile Phone Cooling Plate Heat Sink Expend Cooling Area Price in Bangladesh.

Advanced Thermal Conductivity: Features a composite heat-leveling plate designed for rapid, uniform heat distribution across a significantly expanded cooling surface.
Precision Hot-Spot Targeting: Engineered for semiconductor coolers; uses a high-capacity heat sink to neutralize thermal peaks instantly.
Ultra-Slim Profile: At just 1mm thin, this plate offers a seamless fit that maintains your phone’s original ergonomic feel.
Secure Industrial Adhesive: Equipped with a high-strength bond to ensure the radiator remains firmly attached during intense gaming sessions.
Device-Safe Silicone: Features a soft silicone protective layer for easy application and removal without scratching or damaging your device.

Upgraded version

Notice: This cooling plate must use with the cooler fans!

If you still need B still just leave a message when you order!